发明名称 WIRE BONDING APPARATUS
摘要 <p>PURPOSE:To accelerate an operating speed by descending a capillary to a height responsive to data stored in memory means at a high speed, and then descending the capillary at a low speed until it is brought into contact with a bonding face. CONSTITUTION:A driving motor 7 is rotated at a high speed to rotate a bonding head support 13 by a cam 24 at a shaft 14 as a center, and a capillary 2 is descended at a high speed until the capillary 2 is arrived at an initial height. The motor 7 is rotated at a low speed to descend the capillary 2 at a low speed. Data showing the height of a position where the end of the capillary 2 is brought into contact with a bonding face is stored in a RAM 11. The capillary 2 is returned to an original position. The capillary 2 is descended on the basis of data showing the height of the bonding face in contact with the capillary 2 in the case of a previous wire bonding, and bonded. Thus, its operating speed is accelerated.</p>
申请公布号 JPH0233943(A) 申请公布日期 1990.02.05
申请号 JP19880184309 申请日期 1988.07.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUNATSU KAZUYUKI
分类号 H01L21/60;B23K20/00 主分类号 H01L21/60
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