发明名称 SOLDE RING MAKING APPARATUS
摘要 The solder ring made by cutting solder wire, bending and rounding it, is used for soldering electronic parts. The apparatus includes carriage (3) with bobin (6), for feeding solder wire; hydraulic mechanism (9) for inserting winding bar (16) and cutter (8) to guide groove (17); push bar (19) mounted on spacer (20), for stripping solder ring; tailstock (18) for catching and switching winding bar; hydraulic part (21) for sliding spacer.
申请公布号 KR900007955(B1) 申请公布日期 1990.10.23
申请号 KR19860010136 申请日期 1986.11.28
申请人 DAE WOO ELECTRONICS CO. LTD. 发明人 LIM MOO-SAENG
分类号 B21F37/00;(IPC1-7):B21F37/00 主分类号 B21F37/00
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