BURN-IN SOCKET AND BURN-IN TEST METHOD USING IT

摘要

PURPOSE: To enable repetitive burn-in tests of a variety of IC chips using normal IC chips separated from a wafer without the need for forming bumps and without injury to the surface of the IC chips. CONSTITUTION: A socket body 30 is provided with a housing well 33 for placing a semiconductor chip to be subjected to a burn-in test. A stepped part 35 is formed around the housing well 33 of the socket body 30. Multiple inner leads 32 are fixed on the stepped part 35 in the socket body 30. Multiple outer leads 31 one end of which is connected to one end of corresponding inner lead and the other end of which is protruded from the socket body 30 are provided. Supporting members 34 are fixed on the housing well 33 for supporting the semiconductor chip.