发明名称 COUPLING STRUCTURE OF LAMINATED WAVEGUIDE LINES
摘要 PROBLEM TO BE SOLVED: To provide coupling structure between the laminated waveguide line and a microstrip line, between the laminated waveguide line and a coplaner line or between the laminated waveguide lines that is easily manufactured by a known multi-layer processing technology. SOLUTION: The coupling structure is a structure to couple a laminated waveguide line 10 provided with a couple of main conductors 2, 3 formed in parallel with a dielectric materil inbetween and two rows of via-hole groups 4 placed at an interval between a cut-off wavelength or below to connect electrically the main conductor layers 2, 3 electrically in a signal transmission direction with other signal transmission line 5 such as a microstrip line, a coplaner line or a laminated waveguide line, a transmission via-hole 6 is extended from an end of the other signal transmission line 5, the other end of the transmission viahole 6 is inserted to the laminated waveguide line 10 and the transmission via-hole is acted as a monopole antenna.
申请公布号 JPH10135714(A) 申请公布日期 1998.05.22
申请号 JP19960290425 申请日期 1996.10.31
申请人 KYOCERA CORP 发明人 UCHIMURA HIROSHI;TAKENOSHITA TAKESHI
分类号 H01P3/00;H01P3/12;H01P5/08;H01P5/107 主分类号 H01P3/00
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