A semiconductor device suitable for surface mount technology (SMT) includes a mounting surface on which an external conductor (line) (12) or similar is to be mounted with solder or similar, and which is equipped with a metal carbonate coating (17a). More specifically the mounting surface has a plated or clad metal layer (13), with a metal carbonate coating (17a) formed on the clad metal layer. The semiconductor device is specifically in the form of a chip-frame or so-called TAB - tape or strip (25) for automatic foil (film) bonding of a circuit board (20) or similar. One mounting surface has a metal carbonate coating (17b) and is used for soldering, thermobonding etc. a chip electrode (30) or external conductor (12).
