Halbleiterchip-Verpackung

摘要

An improved package for semiconductor chips, and method of forming the package are provided. The package includes a lead frame (12) having a central chip (10) bonding portion and first (16) and second (18) sets of interdigitaled fingers. The inner ends of the first set of fingers terminate at a distance from the central chip bonding portion closer than the inner ends of the fingers of the second set at fingers. A semiconductor chip, having input/output pads is bonded to the central chip bonding portion (13). A first set of wires (20) directly couples respective input/output pads on the chip to the first set of fingers. A second set of wires (22) couples respective input/output pads on the chip with the second set of fingers. Each of the wires of the second set of wires has a first segment extending from its respective input/output pad to an intermediate bonding region, and a second segment extending from the intermediate bonding region to its respective finger of the second set of fingers.