| 摘要 |
The invention relates to an apparatus for achieving good contact between earth legs (11b, 11d) of a microwave circuit (1) against a corresponding earth connection on a circuit board (3). Earth connection areas (15a, 15b) are shaped directly from a carrier (5) of the circuit board (3), said carrier (5) being manufactured of an electrically conducting material, such as brass or copper, at the location on the circuit board (3) where the microwave circuit (1) is mounted, so that the earth connection areas (15a, 15b) protrude up above the top side (13) of the carrier. The microwave circuit (1) is mounted against the circuit board (3) at the intended location by connecting its legs (11a, 11b, 11c, 11d) to the intended connection area on the circuit board (3), the earth legs (11b, 11d) of the microwave circuit being connected against the shaped earth connection areas (15a, 15b). A method for manufacturing the above apparatus is described. |
