| 摘要 |
<p>PURPOSE:To reduce the size of a TAB chip without deteriorating the resistance of a lead against a mechanical stress caused by the difference in coefficient of thermal expansion between the TAB chip and a high-density board on which the chip is mounted. CONSTITUTION:In a TAB chip composed of an LSI chip 3 and a plurality of copper leads formed in a pattern from TAB tapes which are arranged around the chip 3 and constituted by sticking rolled copper plates to insulating tapes, the length of the TAB leads 5 elongated in the direction coincident with the rolling direction of the rolled copper plates is made longer than that of the TAB leads 4 elongated in the direction perpendicular to the rolling direction of the copper plates.</p> |
