发明名称 |
INDUCTION HEATING SOLDERING METHOD, AND ITS DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To melt a solder without scattering it and to reduce the restriction in arranging parts. SOLUTION: A pair of tips 2a, 2b are arranged opposite to each other across a part to be soldered on a work 1. Both tips 2a, 2b are magnetically coupled with each other through a yoke 3. The tip 2b is passed through a heating coil 4, and a high frequency current flows in the heating coil 4 to form a high frequency magnetic field between the tips 2a, 2b. A solder generates heat and is melted by the electromagnetic induction heating caused by the high frequency magnetic field to conduct the soldering.
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申请公布号 |
JP2000042730(A) |
申请公布日期 |
2000.02.15 |
申请号 |
JP19980212406 |
申请日期 |
1998.07.28 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
SHIMA KAZUYOSHI;WATANABE OSAMU;OGASAWARA TAKU |
分类号 |
H05B6/10;B23K1/002;B23K3/00;(IPC1-7):B23K1/002 |
主分类号 |
H05B6/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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