发明名称 INDUCTION HEATING SOLDERING METHOD, AND ITS DEVICE
摘要 PROBLEM TO BE SOLVED: To melt a solder without scattering it and to reduce the restriction in arranging parts. SOLUTION: A pair of tips 2a, 2b are arranged opposite to each other across a part to be soldered on a work 1. Both tips 2a, 2b are magnetically coupled with each other through a yoke 3. The tip 2b is passed through a heating coil 4, and a high frequency current flows in the heating coil 4 to form a high frequency magnetic field between the tips 2a, 2b. A solder generates heat and is melted by the electromagnetic induction heating caused by the high frequency magnetic field to conduct the soldering.
申请公布号 JP2000042730(A) 申请公布日期 2000.02.15
申请号 JP19980212406 申请日期 1998.07.28
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SHIMA KAZUYOSHI;WATANABE OSAMU;OGASAWARA TAKU
分类号 H05B6/10;B23K1/002;B23K3/00;(IPC1-7):B23K1/002 主分类号 H05B6/10
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