| 摘要 |
PROBLEM TO BE SOLVED: To prevent, as much as possible, stress occurring from a resin sealing member related to an integral package herein an element which dislikes stress and scattering of incident light and normal semiconductor element are electrically connected. SOLUTION: On an island, an insulating substrate 10 is provided, on which first and second semiconductor elements 14 and 15 are fitted tightly. The island and the insulating substrate 10 are provided with a recessed part HB, where a first lead 18 is extended. A second resin-sealing member 22 is coated on a second semiconductor element 15 and a metal thin-wire 19, which is in that condition incorporated into dies K1 and K2, with a first resin sealing member 23 injected so that the second resin-sealing member abuts against the die K1. |
