发明名称 Low profile high density sockets and related method of manufacturing
摘要 <p>The invention resides in an electrical connector (2) capable of being used in an array of contact element (12, 12', 12'') disposed between two parallel spaced apart plates defining a gap (70) into which the connector (2) is inserted. The connector (2) employs a plurality of spacer bars (14) on which are carried a plurality of contact rings which are spaced apart from one another by one or more spacer elements (16, 16'). The position of the contact elements (12, 12', 12'') can be readily varied from one spacer bar (14) to the other by the addition or elimination of one or more spacers to customize the contact array for adapting to the contact placement on the contact plates. Another embodiment of the invention may include using spacer rods made from an elastomeric material which can be stretched to allow the contact rings to be slid over a necked down portion of the rod (16). <IMAGE></p>
申请公布号 EP1094556(A2) 申请公布日期 2001.04.25
申请号 EP20000122236 申请日期 2000.10.17
申请人 BERG ELECTRONICS MANUFACTURING B.V. 发明人 BELOPOLSKY, YAKOV
分类号 H01R11/01;H01R12/52;H01R12/70;H01R13/24;H01R43/00;(IPC1-7):H01R12/22 主分类号 H01R11/01
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