THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATED BOARD FOR WIRING BOARD AND PRINTED WIRING BOARD USING THE SAME

摘要

A thermosetting resin composition which comprises 35 to 75 parts by weight o f (A) a thermosetting resin comprising as the main component a compound having a dihydrobenzoxazine ring, 10 to 25 parts by weight of (B) a polycondensate of a phenol, a compound having a triazine ring, and an aldehyde, and 10 to 40 par ts by weight of (C) an epoxy resin, per 100 parts by weight of the sum of the organic solid matters in the ingredients (A), (B), and (C), the ingredient ( C) comprising (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000 or (ii) an epoxy resin mixture of a bisphenol F epo xy resin having a weight-average molecular weight of 1,000 to 3,000 with a bisphenol A epoxy resin, the amount of the ingredient (i) or (ii) being 0 to 100 wt.% based on the ingredient (C).