| 摘要 |
<p>PURPOSE:To provide a cleaning technology having the capability of reducing the deposition of a foreign substance on a semiconductor device pattern transfer mask. CONSTITUTION:Regarding a mechanical cleaning method for rubbing and cleaning the surface of a thin board with a brush, the center of at least one principal plane 1a of two principal planes of the board is covered with a concealing body 7 and, at the same time, the non-concealed section thereof is rubbed and mechanically cleaned with the first brushes 6a to 6c. On the other hand, the principal plane 1a covered with the concealing body 7 is rubbed and mechanically cleaned with the second brushes. In this thin board cleaning method, the board is otherwise chemically cleaned with chemicals and washed with distilled water. Furthermore, the edge 1c and the peripheral section of the principal plane 1a of the board are rubbed and mechanically cleaned with the first brushes 6a to 6c. Then, the center of the principal plane la is rubbed and mechanically cleaned with the second brushes, and then dried. In this cleaning method, the edge 1c and the peripheral section of the principal plane 1a are rubbed and mechanically cleaned with the first brushes 6a to 6c in the first mechanical cleaning tank, and the center of the principal plane 1a is rubbed and mechanically cleaned with the second brushes in the second mechanical cleaning tank separated from the first mechanical cleaning tank.</p> |
