发明名称 |
Electro chemical mechanical polishing method |
摘要 |
Embodiments of the invention include a method for electro chemical mechanical polishing of a substrate. The process includes flowing an electro chemical mechanical polishing (ECMP) slurry having a high viscosity with a polishing agent over a portion of the substrate. Electrical current is passed through the slurry and substrate. The electrical current, in conjunction with the abrading action of the slurry as it flows over the surface of the substrate, serves to remove at least a portion of the metal layer from the substrate. The invention also includes various slurry embodiments.
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申请公布号 |
US6858531(B1) |
申请公布日期 |
2005.02.22 |
申请号 |
US20020195044 |
申请日期 |
2002.07.12 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
ZHU MEI;CATABAY WILBUR G. |
分类号 |
B23H5/08;C25D3/02;H01L21/321;H01L21/768;(IPC1-7):H01L21/476 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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