METHOD FOR INSPECTING SOLDER BALL, APPARATUS FOR INSPECTING SOLDER BALL OF SEMICONDUCTOR COMPONENT IMPLEMENTING THE SAME, AND APPARATUS FOR TRANSMITTING SOLDER BALL OF SEMICONDUCTOR COMPONENT

摘要

A method for inspecting solder balls, an apparatus for examining the solder balls of a semiconductor device employing the same, and an apparatus for transferring the solder balls of the semiconductor device are provided to determine an attachment status of the solder balls without using a camera by using a determination processing unit. Solder balls(3) received in a solder ball receiving die(120) are bonded to a solder ball transferring die(130). The solder ball transferring die has plural ball accommodating grooves that make the divided solder balls be placed on a semiconductor element. At least one electricity pattern(140) connects the ball accommodating grooves of the solder ball transferring die so that both ends of two solder balls are shorted. A short detecting unit detects whether or not the electricity pattern is shorted. A determination processing unit determines whether or not the solder balls are correctly bonded to the ball accommodating grooves based on the short of the electricity pattern.