| 摘要 |
A polish pad supporting body and a CMP(Chemical Mechanical Polishing) apparatus with the same are provided to restrain the contamination of a semiconductor device by exhausting an unwanted material transmitted to a surface of a lower plate of a cover to an outer side of a polish pad using a predetermined tilt angle of the lower plate of the cover. A polish pad supporting body includes a polish head, a driving unit, and a cover. The polish head(132) is arranged on a polish pad(112). The polish head holds a substrate in order to make a polish object surface of the substrate contact the polish pad. The driving unit(136) is installed on the polish head. The driving unit is capable of supplying torque to the polish head through a cam shaft(134) connected with the polish head. The cover(138) is prolonged to an upper portion of the polish pad in order to support the driving unit. The cover is capable of enclosing the driving unit. A lower plate(138a) of the cover is arranged opposite to the polish pad. The lower plate has a predetermined tilt angle against the polish pad.
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