A TEST SYSTEM AND TEST METHOD THEREOF

摘要

A test system and a test method are disclosed. The test system comprises a PCB and a test apparatus. The PCB comprises a plurality of leads and a plurality of test pads dispose correspondingly on the plurality of leads. The surface of each test pad comprises a bean structure formed by solder paste. The test apparatus comprises a plurality of probes. Each probe comprises a probe head and corresponds to each test pad. The PCB is tested by .the plurality of probes contacting the plurality of bean structures. The cross-sectional diameter of each probe head may be wider than the diameter of each test pad.