| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for cleaning integrated circuit substrates.SOLUTION: A composition for cleaning integrated circuit substrates comprises: water; an oxidizer comprising an ammonium salt of an oxidizing species; a corrosion inhibitor comprising a primary alkylamine having the general formula R'NH, where R' is an alkyl group containing about 150 or less carbon atoms and is more often an aliphatic alkyl group containing from about 4 to about 30 carbon atoms; optionally, a water-miscible organic solvent; optionally, an organic acid; optionally, a buffer species; optionally, a fluoride ion source; and optionally, a metal chelating agent.SELECTED DRAWING: Figure 1 |
