| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which has excellent electric insulation reliability and in which an electric short circuit never occurs between a pad pattern and a solid pattern surrounding the pad pattern.SOLUTION: A wiring board 20 comprises a via hole conductor 10 which is integrally formed direct under a pad pattern 14 and in which a solid pattern 11 and a pad pattern 14 are formed in a loading part 20A of an insulating substrate 1, and a solder resist layer 3 deposited on the insulating substrate 1 including the solid pattern 11 and the pad pattern 14. The interval W2 with the solid pattern 11 in the pad pattern 14 formed integrally with the via hole conductor 10 located at a corner of the loading part 20A is larger than the thickness of the solder resist layer 3 at least on the center side of the loading part 20A.SELECTED DRAWING: Figure 2 |
