A pin-less power coupling arrangement comprising at least one pin-less power jack; the power jack comprising a primary coil shielded behind an insulating layer for inductive coupling to a pin-less power plug; said power plug comprising a secondary coil wherein said insulating layer is substantially flat and said power plug and said power jack may be aligned by an alignment means. Various such alignment means are discussed as are enabled surfaces for supporting inductive power jacks and inductive plugs coupled to various appliances.
