发明名称 |
Semiconductor device |
摘要 |
A semiconductor device includes an n-type semiconductor substrate, which has a main surface having an element region and an outer peripheral region surrounding the element region; a p-type guard ring, which includes: a lowly-doped p-type region disposed on an upper surface of the semiconductor substrate in the outer peripheral region surrounding the element region; and a highly-doped p-type region disposed on an inner side of the lowly-doped p-type region and having an impurity concentration higher than an impurity concentration of the lowly-doped p-type region, wherein a side surface and a bottom surface of the highly-doped p-type region are covered by the lowly-doped p-type region such that the highly-doped p-type region is not in contact with the n-type region; and an ohmic junction electrode, which forms an ohmic junction with the highly-doped p-type region. |
申请公布号 |
US9391136(B1) |
申请公布日期 |
2016.07.12 |
申请号 |
US201514747212 |
申请日期 |
2015.06.23 |
申请人 |
Sanken Electric Co., LTD. |
发明人 |
Kawaguchi Hiroko;Kumakura Hiromichi;Yoshie Toru;Okubo Shuichi |
分类号 |
H01L31/0312;H01L29/06;H01L29/872 |
主分类号 |
H01L31/0312 |
代理机构 |
Banner & Witcoff, Ltd. |
代理人 |
Banner & Witcoff, Ltd. |
主权项 |
1. A semiconductor device comprising:
an n-type semiconductor substrate, which has a main surface having an element region and an outer peripheral region surrounding the element region; a p-type guard ring, which includes:
a lowly-doped p-type region disposed on an upper surface of the semiconductor substrate in the outer peripheral region surrounding the element region; anda highly-doped p-type region disposed on an inner side of the lowly-doped p-type region and having an impurity concentration higher than an impurity concentration of the lowly-doped p-type region, wherein a side surface and a bottom surface of the highly-doped p-type region are covered by the lowly-doped p-type region such that the highly-doped p-type region is not in contact with the n-type region of the semiconductor substrate; an ohmic junction electrode, which forms an ohmic junction with the highly-doped p-type region; and a Schottky junction electrode, which is disposed on the upper surface of the element region and forms a Schottky junction with the semiconductor substrate, wherein the ohmic junction electrode is disposed on the upper surface of the Schottky junction electrode. |
地址 |
Niiza-shi, Saitama JP |