发明名称 Semiconductor device
摘要 A semiconductor device includes an n-type semiconductor substrate, which has a main surface having an element region and an outer peripheral region surrounding the element region; a p-type guard ring, which includes: a lowly-doped p-type region disposed on an upper surface of the semiconductor substrate in the outer peripheral region surrounding the element region; and a highly-doped p-type region disposed on an inner side of the lowly-doped p-type region and having an impurity concentration higher than an impurity concentration of the lowly-doped p-type region, wherein a side surface and a bottom surface of the highly-doped p-type region are covered by the lowly-doped p-type region such that the highly-doped p-type region is not in contact with the n-type region; and an ohmic junction electrode, which forms an ohmic junction with the highly-doped p-type region.
申请公布号 US9391136(B1) 申请公布日期 2016.07.12
申请号 US201514747212 申请日期 2015.06.23
申请人 Sanken Electric Co., LTD. 发明人 Kawaguchi Hiroko;Kumakura Hiromichi;Yoshie Toru;Okubo Shuichi
分类号 H01L31/0312;H01L29/06;H01L29/872 主分类号 H01L31/0312
代理机构 Banner & Witcoff, Ltd. 代理人 Banner & Witcoff, Ltd.
主权项 1. A semiconductor device comprising: an n-type semiconductor substrate, which has a main surface having an element region and an outer peripheral region surrounding the element region; a p-type guard ring, which includes: a lowly-doped p-type region disposed on an upper surface of the semiconductor substrate in the outer peripheral region surrounding the element region; anda highly-doped p-type region disposed on an inner side of the lowly-doped p-type region and having an impurity concentration higher than an impurity concentration of the lowly-doped p-type region, wherein a side surface and a bottom surface of the highly-doped p-type region are covered by the lowly-doped p-type region such that the highly-doped p-type region is not in contact with the n-type region of the semiconductor substrate; an ohmic junction electrode, which forms an ohmic junction with the highly-doped p-type region; and a Schottky junction electrode, which is disposed on the upper surface of the element region and forms a Schottky junction with the semiconductor substrate, wherein the ohmic junction electrode is disposed on the upper surface of the Schottky junction electrode.
地址 Niiza-shi, Saitama JP
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