| 发明名称 |
SEMICONDUCTOR LASER APPARATUS AND MANUFACTRUING METHOD THEREOF |
| 摘要 |
A semiconductor laser apparatus includes a silicon-on-insulator assembly and an edge-emitting semiconductor laser assembly integrated on the silicon-on-insulator assembly. The silicon-on-insulator assembly includes an optical waveguide at the top which is bonded to the edge-emitting semiconductor laser assembly and configured to couple a laser light emitted from the edge-emitting semiconductor laser assembly, and the optical waveguide includes a core portion located in the middle of the optical waveguide; and at least one vertical rib configured on two sides of the core portion respectively, with a width narrower than that of the core portion. The apparatus obtains a single mode laser operation and has low propagation loss and high mechanical bond strength. |
| 申请公布号 |
US2016211645(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201514600443 |
申请日期 |
2015.01.20 |
| 申请人 |
SAE Magnetics (H.K.) Ltd. |
发明人 |
PADULLAPARTHI Babu Dayal |
| 分类号 |
H01S5/022;G02B6/136;H01S5/125;H01S5/02;H01S5/34;H01S5/12;G02B6/42;G02B6/122 |
主分类号 |
H01S5/022 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor laser apparatus, comprising:
a silicon-on-insulator assembly; and an edge-emitting semiconductor laser assembly integrated on the silicon-on-insulator assembly; the silicon-on-insulator assembly comprising an optical waveguide at the top which is bonded to the edge-emitting semiconductor laser assembly and configured to couple a laser light emitted from the edge-emitting semiconductor laser assembly, wherein the optical waveguide comprises: a core portion located in the middle of the optical waveguide; and at least one vertical rib configured on two sides of the core portion respectively, with a width narrower than that of the core portion. |
| 地址 |
Hong Kong CN |
