EDGE-EMITTING LASER CHIP WAFER LAYOUT THAT FACILITATES ON-WAFER TESTING OF THE LASERS

摘要

Edge-emitting laser chip wafer layouts are provided that enable a variety of tests to be performed while the chips are on the wafer, including side-mode suppression ratio (SMSR) tests. The laser chip wafer layouts include turning mirrors that direct light passing out of at least one of the facets of the chips away from the wafer. Directing the light out of the wafer in this manner allows external test and measurement equipment to perform SMSR testing on the chips prior to singulation.

主权项

1. A semiconductor wafer comprising:
a plurality of edge-emitting laser chips having respective edge-emitting lasers that emit laser light from facets formed in edges of the chips; and a plurality of turning mirrors disposed on the wafer, each turning mirror receiving laser light emitted from one of the chips and turning the received laser light away from the wafer at a non-zero-degree angle relative to a plane in which one of an upper surface and a lower surface of the wafer lies.