BUMP STRUCTURES, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE HAVING THE SAME

摘要

The present disclosure relates to bump structures and a semiconductor device and semiconductor device package having the same. The semiconductor device includes a body, at least one conductive metal pad and at least one metal pillar. The body includes a first surface. The at least one conductive metal pad is disposed on the first surface. Each metal pillar is formed on a corresponding conductive metal pad. Each metal pillar has a concave side wall and a convex side wall opposite the first concave side wall, and the concave side wall and the convex side wall are orthogonal to the corresponding conductive metal pad.

主权项

1. A semiconductor device, comprising:
a body comprising a first surface; at least one conductive metal pad disposed on the first surface; and at least one metal pillar, wherein each metal pillar is formed on a corresponding one of the at least one conductive metal pad and comprises a concave side wall and a convex side wall opposite the first concave side wall, the concave side wall and the convex side wall being orthogonal to the corresponding conductive metal pad.