| 摘要 |
The present invention relates to a fingerprint sensor package capable of having increased sensing sensitivity and being made to be thinner, and a manufacturing method thereof. The fingerprint sensor package according to an embodiment of the present invention includes a fingerprint sensor, a body, a redistribution line unit, and a cover window. The fingerprint sensor includes a sensing unit detecting a fingerprint. The body is formed to be integrated with the fingerprint sensor, and includes via holes arranged around the fingerprint sensor to be spaced apart from each other, formed in a heightwise direction, and providing electrical connection. The redistribution line unit electrically connects a bonding pad provided at an upper surface of the fingerprint sensor with an upper end part of the via hole. The cover window is provided at an upper portion of the body to cover the redistribution line unit. |
