METHOD FOR MANUFACTURING CIRCUIT BOARD, CIRCUIT BOARD AND PLASMA DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing technology of a circuit board that can achieve mass production and practical use of a circuit board by manufacturing a circuit board at an inexpensive price.SOLUTION: The method for manufacturing a circuit board comprises: a metal particle deposition step of depositing metal particles having an average particle size of 100 nm or more by depositing metal particles by a polyol process; an ink paste preparation step of preparing an ink paste using the deposited metal particles; a coating film formation step of applying the prepared ink paste to a surface of an insulation substrate to form a coating film; and a conductive layer circuit formation step of sintering the metal particles while maintaining the insulation substrate at a temperature of 150°C or lower to form a circuit of a conductive layer on the insulation substrate by using a mixed gas of a hydrogen atom-containing gas and a rare gas as a process gas while controlling the pressure of the mixed gas to a predetermined pressure of 1 to 100 Pa, and generating high-frequency plasma and irradiating the surface of the coating film formed on the insulation substrate with the plasma under the condition that a plasma electric power density is controlled to a predetermined electric power density of 0.01 W/cmor more.SELECTED DRAWING: None