| 发明名称 |
BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS OF ASSEMBLING AND OPERATING THE SAME |
| 摘要 |
Provided is a bond head assembly for bonding a semiconductor element onto a substrate. The bond head assembly includes: a base structure; a heater; and a clamping system fixing the heater to the base structure. The clamping system includes a plurality of elastic elements restricting the heater along a plurality of axes. |
| 申请公布号 |
KR20160105332(A) |
申请公布日期 |
2016.09.06 |
| 申请号 |
KR20160022474 |
申请日期 |
2016.02.25 |
| 申请人 |
KULICKE AND SOFFA INDUSTRIES, INC. |
发明人 |
WASSERMAN MATTHEW B. |
| 分类号 |
H01L21/447;H01L21/18;H01L21/67;H01L21/687;H01L23/00 |
主分类号 |
H01L21/447 |
| 代理机构 |
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代理人 |
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| 主权项 |
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