FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

摘要

Disclosed are a flexible printed circuit board and a method of manufacturing the same, wherein a deposition seed layer is formed on a substrate, a circuit cover layer having a circuit pattern groove in the shape of a circuit pattern is formed on the deposition seed layer, the circuit pattern groove is plated with a circuit plating layer, followed by etching, thus forming a circuit pattern, thereby realizing low-resistance characteristics, reducing manufacturing costs through a simple and easy manufacturing process, and increasing productivity.

主权项

1. A flexible printed circuit board, comprising:
a flexible substrate; and a circuit pattern provided on the substrate and formed of a conductor, wherein the circuit pattern comprises a deposition seed layer formed by deposition on the substrate and a circuit plating layer formed by plating on the deposition seed layer, and the circuit plating layer is formed so as to cover an upper surface of the deposition seed layer, other than a circumference of the deposition seed layer.