MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

摘要

Manufacturing a product, wherein the product includes a first part and a second part, wherein the first part includes solder pins and the second part includes solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead. Aligning the solder pins against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead. Connecting a mating connector to the first part, wherein the mating connector is operable for providing a part of an electrical conducting path. Heating at least one of the solder paste beads by an electrical resistive heating, wherein the electrical resistive heating is generated by an electrical current flowing through the electrical conducting path, wherein the solder paste bead undergoes a soldering process facilitated by the electrical resistive heating, wherein a temperature of the solder paste bead is being evaluated, wherein the electrical resistive heating is adjusted according to the temperature of the solder paste bead.

主权项

1. A system for manufacturing a product, wherein the product comprises a first part and a second part, wherein the first part comprises solder pins and the second part comprises solder pads, wherein each of the solder pins has the matching solder pad, wherein each of the solder pads is covered by a matching solder paste bead, the system comprising:
a mating connector, wherein the mating connector is operable for providing a part of an electrical conducting path when the mating connector is connected to the first part, wherein the electrical conducting path is used for a flow of an electrical current, wherein the electrical current is used for generation of an electrical resistive heating, wherein the electrical resistive heating is used to facilitate a soldering process of at least one solder paste bead wherein the solder pins are aligned against the solder pads in a way that each pair of the solder pin and the matching solder pad is thermally and electrically connected by the matching solder paste bead; a sensor to facilitate evaluation of a temperature of the solder paste bead during the soldering process facilitated by the electrical resistive heating; and a controller to adjust the electrical resistive heating of said solder paste bead during the soldering process facilitated by the electrical resistive heating according to the temperature of said solder paste beads.