| 摘要 |
1,151,903. Direct connections. ELECTRIC & MUSICAL INDUSTRIES Ltd. 19 May, 1966 [2 June, 1965], No. 23428/65. Heading H2E. [Also in Division H1] In a printed circuit assembly, raised conductive portions 9 are added to printed wiring 7 and a semi-conductor integrated circuit chip 10 is connected to such raised portions without the prior addition of conductors to the semiconductor chip. A ceramic substrate 1 is provided on one face, by fired screen printing, with resistors (2, Fig. 1, not shown), and conductors and capacitor electrodes (3, 4, Fig. 2, not shown). A layer 5 of glass frit having apertures therethrough at predetermined points is bonded over the said one face, and a pattern of conductors 7 and further capacitor electrodes (8, Fig. 4, not shown) is formed by depositing conductive material on layer 5 and through the apertures therein, as by evaporation through a mask. Further evaporation produces raised portions 9, to which chip 10 is connected by ultra-sonic welding; alternatively, the portions 9 are pre-tinned and hot gas is applied to solder the chip thereto. The substrate may alternatively be of glass, and the layer 5 of SiO; instead of using firing techniques, circuit elements may be formed by evaporation, printing, pyrolytic deposition, or cataphoresis. |
