摘要 |
1,153,400. Wire springs. STANDARD TELEPHONES & CABLES Ltd. 10 April, 1968, No. 17374/68. Heading F2S. [Also in Divisions H1 and H2] A resilient wire clip 8 for use in making contact to a semi-conductor wafer 1 (see Division H1) has two arms 9, 10 joined through loops 12, 13 to a link section 11. Downwardly bent portions 14, 15 of the arms 9, 10 carry foot portions 16, 17 for engagement with electrodes 2, 3 of the wafer 1. |