| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive tape which can be adhered at relatively low temps., hardly damages semiconductor chips when adhered, and does not cause a part adhered at a first thermal pressing step to be softened at a second thermal pressing step by forming, on both sides of a substrate, polyimide-contg. layers having glass transition points different from each other. SOLUTION: This adhesive tape is prepd. by forming, on each side of a 5-200μm - thick substrate, an at least 5μm - thick adhesive layer which contains at least one polyimide comprising 100-40mol% at least one kind of structural unit selected from among units represented by formulas I and II (wherein Ar is a divalent group selected from among groups represented by formula III; and R<1> to R<4> are each H, a 1-4C alkyl, or a 1-4C alkoxy) and 0-60mol% at least one kind of structural unit selected from among units represented by formulas IV and V. Pref. the adhesive layers on both sides of the substrate are different in glass transition point from each other by at least 30 deg.C. |
