| 摘要 |
PURPOSE:To reduce the area of bonding pad needed for wire bonding drastically and the chip area of a semiconductor chip by bonding a metal wire to a recessed area formed at the bonding pad part. CONSTITUTION:One of a plurality of recessed parts 3b are provided at one part or the enter area of the surface of a bonding pad part 3a. At the same time, a distribution pad metal 4 is formed on the surface of the bonding pad part 3a including this recessed part. After that, a metal wire 7 is bonded to this bonding pad part 3 by the ball bonding method. In this case, since the recessed part 3b is arranged at the bonding pad part 3a. it will not expand in horizontal direction even if the ball of a metal wire 7 is crashed due to bonding. Thus the semiconductor device 1 and the metal wire 7 can be bonded at a little bonding area which is nearly equal to the sectional area of the metal wire 7 to be bonded. |
