| 摘要 |
<p>PURPOSE:To prevent the peeling of the lead wires of a semiconductor device by a method wherein a CVD deposited film under the lower part of each bonding pad is removed to leave a thermal oxide film only and the bonding pad is made a pure Al film. CONSTITUTION:A semiconductor device is constituted by a method wherein a CVD deposited film 3 under the lower part of each bonding pad is removed and an Al film 4 constituting the bonding pad is made a pure Al film. As a result, a wire peeling, which is generated due to a thermal stress at the time of solder packaging, can be prevented.</p> |
