| 摘要 |
PURPOSE:To obtain a low temperature baked ceramic multilayer board which is excellent in bonding strength and soldering wetness and allows high density fine patterns to be thereon formed by coating a ceramic green sheet baked at a low temperature with a conductive paste in which predetermined amounts of Ag, Pd, Cr, RuO2, Rh are mixed and by baking the coated ceramic green sheet at a predetermined temperature. CONSTITUTION:Materials such as a low temperature baked ceramic, an organic binder, a plasticizer, and a solution are converted into a slurry in a ball mill and formed into a green sheet by a doctor blade method. A conductive paste is prepared by mixing powders of Ag, Pd, Cr, RuO2, and Rh together with an organic vehicle. The ratio of addition of these powders with the total of Ag and Pd being 100 parts by weight are as follows: 70-100 parts by weight for Ag, 0-30 parts by weight for Pd, 0.01-8.0 parts by weight for Cr, and X and Y parts by weight for RuO2 and Rh, respectively, X and Y being within the range determined by the following formulas: (-1/7)X+1.0>=Y>=-0.05X+0.01, X>0, Y>=0 (where, X is a value in parts by weight for RuO2 and Y is a value in parts by weight for Rh). The obtained paste is screen-printed on the ceramic green sheet, stacked where necessary, and thin backed at 800-1000 deg.C. |
