| 摘要 |
PURPOSE:To feed easily a conductive bonding agent without needing a dropping device and a stamping tool and to reduce a control manhour by a method wherein the conductive bonding agent is in advance to a mounting component and thereafter, the mounting component is bonded to a matter to be mounted. CONSTITUTION:A conductive bonding agent 1 on a receiving pan 2 is thinly stretched using a scraper 3. Then, a mounting component 4 is pinched by a handling tool 5 and is suppressed on the surface, on which the bonding agent 1 is thinly stretched, of the receiving pan to transfer the bonding agent 1 on the component 4. After that, the component is die bonded on a matter 6 to be mounted to form a die bonding. Thereby, the conductive bonding agent can be easily fed without needing a dropping device for feeding the conductive bonding agent and a stamping tool for stamping in every size of mounting components and a control manhour can be reduced.
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