| 摘要 |
PURPOSE:To improve the mounting workability of a printed board while executing oscillation and noise preventive countermeasures by installing a magnetic substance at the specified position of a bonding wire. CONSTITUTION:A magnetic substance 6 is mounted at the predetermined position of a wire 5-for example, ferrite beads are fitted to the wire or a magnetic film is applied to the wire. The magnetic substance 6 set up to the wire 5 blunts a steep current change and eliminates a high-frequency component causing oscillation and noises at that time. The magnetic substance 1 is fitted into a semiconductor device in response to the diameter of the wire when a semiconductor is assembled. Accordingly, externally attached components at the time of the mounting of a printed board are decreased, thus allowing improvement in the workability of the mounting of the printed board while allowing the scaling-down of the printed board without increasing the area of mounting. |
