FORMATION OF POLYIMIDE PATTERN LAYER AND RINSING SOLUTION USED FOR SAID FORMATION

摘要

PURPOSE:To make the edge of a photoset polyimide pattern layer formed on a substrate roundish by immersing the substrate in a specified rinsing soln. for forming a photoset polyimide pattern layer to rinse the substrate and carrying out heat treatment at a high temp. CONSTITUTION:A photosensitive polyimide layer on a substrate is patternwisely photoset by exposure and the unexposed part is removed with a developing soln. to carry out development. The substrate 1 having a formed photoset polyimide pattern layer 2 is rinsed by immersion in a rinsing soln. for forming a photoset polyimide pattern layer contg. 5-30vol.% prim. aliphat. amino compd. and 2-20vol.% aprotic basic solvent. The substrate 1 is then heat-treated at a high temp. The peripheral part of the pattern layer 2 is inclined to the substrate 1 and the corner is made roundish, so the breaking of a wire on the pattern layer is prevented when a multilayered circuit board is produced.