发明名称
摘要 PURPOSE:To prevent the release between a heat generating resistor layer and a conductive layer in the case of use in a thermal transfer printing system by constituting the conductive layer of a laminated structure consisting of the first conductive layer containing at least one metal selected from a specific metal group and the second conductive layer based on Al or an Al alloy. CONSTITUTION:The conductive layer provided on a heat generating resistor layer 12 has a laminated structure consisting of the first and second conductive layers 13, 14 and the first conductive layer 13 acts as the adhesive layer of the heat generating resistor layer 12 and the second conductive layer 14. The first conductive layer 13 is composed of a layer containing 60% or more of at least one metal selected from a group consisting of Ni, Cr, Fe, Co, Ru, Rh, Ta and In and the thickness thereof is set to 1,000Angstrom or less. The second conductive layer 14 is composed of a layer based on Al or an Al alloy and having a thickness of 500Angstrom or more. Since the first conductive layer acts as the adhesive layer of the heat generating resistor layer and the second conductive layer, no release is generated between the conductive layer and the heat generating resistor layer even when stress due to a heat shock or a sudden current supply phenomenon is applied at the time of printing recording.
申请公布号 JP2696935(B2) 申请公布日期 1998.01.14
申请号 JP19880143506 申请日期 1988.06.13
申请人 发明人
分类号 B41M5/382;B41M5/20;B41M5/26;B41M5/40;B41M5/41 主分类号 B41M5/382
代理机构 代理人
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