PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION AND METAL FOIL-POLYIMIDE COMPOSITE

摘要

PROBLEM TO BE SOLVED: To obtain the photosensitive composition free from any problem on mechanical strength and heat resistance and flexibility and low in linear expansion coefficient and further superior in patterning workability by incorporating a specified polyimide precursor and photopolymerization initiator. SOLUTION: This composition contains the photopolymerization initiator and the photosensitive polyimide precursor represented by the formula in which R<1> is a >=2C tri- or tetra-valent acid residue; R<2> is an aromatic diamine residue or a >=2C aliphatic diamine residue; R<3> is a -OR<4> , -NHR<4> , or -O<-> N<+> R<4> R<5> R<6> R<7> group; but R<4> is a group having an ethylenically unsaturated bond; each of R<5> -R<7> is an H atom or a 1-10C alkyl group; and (n) is 1 or 2. The film obtained by forming this composition into a film form and curing it has a linear expansion coefficient of 10×10<-6> -30×10<-6> / deg.C at 30 deg.C.