| 摘要 |
An IC mounting structure and a communication apparatus is provided in which the structure of a circuit substrate is improved, the positional relationship between an IC and an antenna member is optimized, and the influence of high-frequency noises from the active surface of the IC can be prevented. In a wrist-fitting communication apparatus, an IC which generates high-frequency noises is face-down bonded on a circuit substrate such that the active surface faces the side opposite to the direction where most of or the entire antenna member is positioned. The circuit substrate is a multilayer substrate in which a shielding electrode layer maintained at the ground potential or a power supply potential is formed. High-frequency noises generated from the active surface of the IC are reduced by the shielding electrode layer. Also, electromagnetic field leaking to the surroundings is weak. Accordingly, the influence of noise upon the antenna member is small.
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