CONDUCTIVE PAD WITH HIGH ABRASION

摘要

A method and apparatus for a planarizing or polishing article for Electrochemical Mechanical Planarization (ECMP) is disclosed. The polishing article is a pad assembly (122) having a plurality of conductive domains and a plurality of abrasive domains on a processing surface. The abrasive domains and the conductive domains comprise a plurality of contact elements (150) that are adapted to bias a semiconductor substrate (115) while also providing abrasive qualities to enhance removal of material deposited on the substrate.