| 摘要 |
PURPOSE:To provide the soldering device capable of stably realizing the temp. profile of each heating zone made by equipping a heat source controllable independently respectively at the upper and lower parts and both side parts of the respective zone of the preheating and main heating zones provided along the transfer route of a printed circuit board. CONSTITUTION:A transfer belt 1 is transferred almost horizontally in the state of supporting a frame body 10, a printed circuit board 11 is mounted on said belt 1 and passes through a leading in part zone A, preheating zone B and main heating zone C in order. While passing through each zone the lead part of a chip part is soldered on the wiring layer of the face of a wiring plate 11 thereon. Meanwhile, the respective zone is passed through by the heat sources 2-5 and 6-9 respectively provided on the upper and lower faces of the zone A and B and the side face along the belt 1 and controllable independently respectively. The circuit board 11 is heated adequately at the necessary temp. The overheat of the circuit board 11 is evaded and the thermal protection of the board 11 and parts can thus be performed. |
