SYMMETRICAL MIM CAPACITOR DESIGN

摘要

Semiconductor chip capacitance circuits and methods are provided comprising at least two capacitors mounted close to a substrate, wherein each capacitor has a lateral lower conductive plate mounted near enough to the substrate to have extrinsic capacitance greater than an upper plate extrinsic capacitance. One half of lower plates and one half of upper plates are connected to a first port, and a remaining one half of upper plates and lower plates are connected to a second port, the first and second port having about equal extrinsic capacitance from the lower plates. In one aspect, the substrate comprises a front-end-of-line capacitor defining a substrate footprint, and the at least two capacitors are back-end-of-line Metal-Insulator-Metal Capacitors disposed above the footprint. In another aspect, the at least two capacitors are at least four capacitors arrayed in a rectangular array generally parallel to the substrate.