| 摘要 |
A manufacturing method of a circuit board is provided to reduce thickness deviation in a copper plating process by adding a polishing process. Thickness of a substrate is reduced by a half-etching process(S10). A hole is formed on a surface of the substrate by a laser drilling(S20). A chemical copper is coated on the substrate(S30). A DFR(Dry Film Resist) coating is performed on the substrate(S40). A DFR development and exposure are performed(S50). Electrolytic copper plating is performed on the substrate(S60). A polishing process is performed on the substrate in order to uniform a plating thickness(S70). A DFR stripping is performed(S80). A soft etching is performed on the substrate(S90). A PSR(Photo Solder Resist) pre-treatment is performed on the substrate(S100). A post-process is performed on the substrate(S110).
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