发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of providing a stable electric property and high reliability to the semiconductor device using an oxide semiconductor.SOLUTION: A method for manufacturing a semiconductor device comprises the steps of: forming a first insulating film; forming a source electrode and a drain electrode, and an oxide semiconductor flim which electrically connects the source electrode and the drain electrode; removing hydrogen atoms in the oxide semiconductor film by subjecting the oxide semiconductor film to heat treatment; supplying oxygen atoms into the oxide semiconductor film by subjecting the oxide semiconductor film from which the hydrogen atoms are removed to oxygen doping treatment; forming a second insulating film on the oxide semiconductor film to which the oxygen atoms are supplied; and forming a gate electrode in a region superimposed on the oxide semiconductor film on the second insulating film.SELECTED DRAWING: Figure 2
申请公布号 JP2016106411(A) 申请公布日期 2016.06.16
申请号 JP20160006744 申请日期 2016.01.18
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI
分类号 H01L21/336;H01L21/8242;H01L27/108;H01L27/146;H01L29/786 主分类号 H01L21/336
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