| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which suppresses mounting failure of a surface mounting component, in a flow soldering step.SOLUTION: A lead terminal connection pad 12 provided on a printed wiring board 10 has a width thinner than that of a lead terminal 13. Consequently, a wider gap is ensured between adjacent solder joints (joint of the lead terminal connection pad 12 and the lead terminal 13). Furthermore, the lead terminal connection pad 12 has a shorter projection length of lead terminal connection pad at the root of lead terminal, than that of a lead terminal connection pad 11 provided on the conventional printed wiring board. Consequently, the solder reservoir at the root of the lead terminal becomes smaller, thus suppressing bridge failure.SELECTED DRAWING: Figure 1 |
