发明名称 |
METAL BASE CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME |
摘要 |
A metal base circuit substrate having a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers the lower surface of the first circuit pattern facing the metal base substrate and at least a region, of the side surface of the first circuit pattern, that is adjacent to the aforementioned lower surface. |
申请公布号 |
WO2016125650(A1) |
申请公布日期 |
2016.08.11 |
申请号 |
WO2016JP52305 |
申请日期 |
2016.01.27 |
申请人 |
NHK SPRING CO., LTD. |
发明人 |
MIZUNO, KATSUMI;IKEDA, DAIKI |
分类号 |
H05K1/05;H05K1/03;H05K3/20;H05K3/44 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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