| 摘要 |
In the present invention, a coating film is polished, before being cured, with a polishing member constituted of polyvinyl alcohol or polyethylene, while keeping the surface of the coating film and the polishing member wet with an addition liquid. Due to this, the coating film 9 can be partly removed while inhibiting a pattern 92 from suffering damage. In the case of using a polishing member 40 constituted of polyvinyl alcohol, nitrogen gas is blown against pure water supplied to a wafer W, so that the amount of the pure water being supplied to the polishing member 40 is regulated. Furthermore, since the SOC film application device is provided with an application unit 2, a polishing unit 3, and a heating unit 5, there is no need of conveying the wafer W to a polishing device or a heating device. It is hence possible to shorten the time required for conveyance between devices and reduce the cost of installing the polishing device or heating device. |
