ADDITION REACTION CURABLE SILICONE RESIN COMPOSITION, AND DIE ATTACH MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an addition reaction curable silicone resin composition which scarcely contaminates a gold electrode pad part of an LED chip when used as a die attach material for an optical semiconductor device and can become a cured product giving a good wire bonding properties, and die attach material for optical semiconductor device composed of the composition.SOLUTION: The addition reaction curable silicone resin composition includes: (A)(A-1) an alkenyl group-containing straight-chain organopolysiloxane having not less than two alkenyl groups in a molecule; (A-2) a terminal alkenyl group-containing branched organopolysiloxane having not less than two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having a molecular weight of not greater than 10, at least one SiH group only on a terminal, and a low molecular weight siloxane content of not greater than 5 mass%; and (C) an addition reaction catalyst.SELECTED DRAWING: None